The most common choice for multilayer PCBs. It maintains ductility at high temperatures, preventing cracks in plated-through holes (PTH) during thermal cycling or soldering.
: Includes individual "slash sheets" (e.g., IPC-4562/1) that provide specific engineering and performance data for different metal foil materials. ANSI Webstore Common Applications Rigid PCB Production ipc-4562 pdf
Learn the codes for foil type (e.g., Electrodeposited vs. Wrought). The most common choice for multilayer PCBs
This standard provides a standardized material designation system for both supported and unsupported foils, allowing precise specification of material properties. The current revision, , specifically addresses the impact of surface roughness on signal integrity for high-speed and RF applications. Core Foil Types and Manufacturing ANSI Webstore Common Applications Rigid PCB Production Learn
: Foils are distinguished by their manufacturing process, such as Electrodeposited (Type E) Wrought/Rolled (Type W) Foil Grades : Grades specify performance levels; for example,
If you have legacy specifications in your documentation, you need to migrate to IPC-4562. Here is why:
IPC-4562B, released in October 2023, is the industry standard defining requirements for metal foils used in printed circuit board (PCB) applications. The standard categorizes copper foils by type (electrodeposited vs. wrought), quality class, and surface profile (standard to HVLP) to ensure performance in rigid or flexible circuits. For a detailed guide on these specifications, visit PCBSync . IPC-4562B - Accuris Standards Store